Infrared module

  • The wafer level optical lens, wafer level packaged detector, and micro electromagnetic valve shutter can accurately obtain temperature data and heat distribution of the target area or point
  • Ultra miniature body structure, ultra-low cost expenditure, can be easily integrated into various mobile terminals or smart devices with strict requirements for cost, size, and weight
  • WLO+WLP achieves a lower cost integration solution, with a weight of up to 1.3g and a power consumption as low as 9mW
  • Covering different lenses such as wide-angle, telephoto, and ultra telephoto, with multiple focusing methods
  • Simple development and fast integration,Universal DVP data output interface
Infrared module
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Filters
Img
Typecode
Output
Measuring length
Mechanical configuration
Resolution
Ambient temperature
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EYAS615L
CameraLink
640×512
-40℃ ~ +71℃
EYAS330
CameraLink
320×256
-40℃ ~ +71℃
EYAS615B
CameraLink
640×512
-40℃ ~ +71℃
EYAS615A
CameraLink
640×512
-40℃ ~ +71℃
EYAS1212A
CameraLink
1280×1024
-40℃ ~ +71℃
MINI212
14 Bit Raw
Metal
256×192
-40℃ ~ +85℃
TIMO256
14 Bit Raw
Metal
256×192
-20℃ ~ +60℃
TIMO120
14 Bit Raw
Metal
120×90
-20℃ ~ +60℃